Supermicro SYS-F619P2-RC1 Sy Sys-f619p2-rc1 4u Xeon S3647 C621 Max3t 6x2.5hs 2200w Brown Box

Motherboard
Super X11DPFR-SN Processor/Cache (per Node)
CPU
Dual Socket P (LGA 3647)
2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors,
Dual UPI up to 10.4GT/s
Support CPU TDP 70-165W with IVR
Cores
Up to 28 Cores
Note
BIOS version 3.2 or above is required to support 2nd Gen Intel Xeon Scalable processors (codenamed Cascade Lake-R) System Memory (per Node)
Memory Capacity
12 DIMM slots
Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Supports Intel Optane DCPMM
Memory Type
2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Cascade Lake only. Contact your Supermicro sales rep for more info. On-Board Devices
Chipset
Intel C621 chipset
SAS
SAS3 (12Gbps) via Broadcom 3108
HW RAID
Network Controllers
Flexible networking via SIOM
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
ASPEED AST2500 BMC Input / Output (per node)
SAS
6 SAS3 (12Gbps) ports
NVMe
4 NVMe U.2 option
LAN
SIOM flexible Network card
1 RJ45 Dedicated IPMI LAN port
USB
2 USB 3.0 ports (rear)
VGA
1 VGA port System BIOS
BIOS Type
128Mb SPI Flash EEPROM with AMI BIOS Management
Software
Intel Node Manager
IPMI 2.0
KVM with dedicated LAN
SuperDoctor 5
Watch Dog
Power Configurations
ACPI Power Management PC Health Monitoring
CPU
Monitors for CPU Cores, Chipset Voltages, Memory.
4+1 Phase-switching voltage regulator
FAN
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors Chassis
Form Factor
4U Rackmount
Model
CSE-F418BC2-R2K20BP
Available Colors
Black Front Panel
Buttons
Power On/Off button
UID button
LEDs
Power status LED
Hard drive activity LED
Network activity LEDs
Information LED (UID, Fan failure, Overheat) Expansion Slots (per node)
PCI-Express
1 PCI-E 3.0 x16 (Low-profile)
1 PCI-E 3.0 x16 (SIOM) Drive Bays (per node)
Hot-swap
6 Hot-swap 2.5" SAS3/SATA3 or 2 Hot-swap 2.5" SAS3/SATA3 + 4 optional NVMe U.2
M.2
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key Backplane
1 SAS/SATA backplane System Cooling (per node)
Fans
3x 4cm 20k RPM middle fans Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
1200W with Input 100-127Vac
1800W with Input 200-220Vac
1980W with Input 220-230Vac
2090W with Input 230-240Vac
2200W with Input 220-240Vac (for UL/cUL use only)
2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
50-60Hz
Dimension (W x H x L)
76 x 40 x 336 mm
+12V
Max: 100A / Min: 0A (100-127Vac)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 183.3A / Min: 0A (220-240Vac)
5VSB
Max: 1A / Min: 0A
Output Type
Backplanes (gold finger)
Certification
Titanium Level Operating Environment
RoHS RoHS Compliant
Environmental Spec.
Operating Temperature:
10^oC 35^oC (50^oF - 95^oF)
Non-operating Temperature:
-40^oC to 60^oC (-40^oF to 140^oF)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing) Item Dimension (L"xW"xH")
43 x 29 x 15

Weight
200 lbs

Warranty Information
1 year